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Low-Expansion Epoxy

June 18, 2008

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Duralco 4463 resists electricity, chemicals and moisture and has good dimensional stability. The low-expansion, 500°F (260°C) epoxy is a user friendly, 100 percent solids system that is mixed, applied and cured at room temperature. The epoxy does not contain volatiles or VOCs and is low odor. It provides adhesion to most glass, ceramics, metals and plastics and is suitable for high-performance bonding and encapsulating applications.
Cotronics Corp., (718) 788-5533


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