Make process improvement your New Year's resolution.
By the time you read this, you probably will have made -- and broken -- your New Year's resolutions. Instead of being disappointed, look at this as an opportunity to make more -- that you can keep -- about improving your process efficiency, operation and accuracy. The articles in this issue of Process Heating should help.
In “Process Improvement Through Thermal Profiling,” Ray Pearce of ECD Inc., Milwaukie, Ore., notes that the goal of thermal profiling is to always increase quality and reduce waste. All heating processes have one thing in common: the process window, or the area where time and temperature come into perfect synchronization. In electronics, it is the point when solder melts to form the perfect electrical connection. In baking, it is where bread reaches the optimum temperature to create a perfect loaf. For powder-coat curing, it is where the coating melds into a permanent seal with the base material of the product. Pearce outlines three case histories that show you how manufacturers with solder reflow, baking and powder curing operations achieved those goals.