The goal of thermal profiling is to always increase quality and reduce waste. Three case histories -- covering powder coating, baking and solder reflow applications -- show you how three manufacturers achieved these goals.
In electronics, it is the point when solder melts to form the perfect electrical connection. In baking, it is where bread reaches the optimum temperature to create a perfect loaf. For powder-coat curing, it is the point where the process melds the coating into a permanent seal with the base material of the product.