T-mate is designed to adhere only to the heat-spreading device while separating cleanly from the chip or component. The material consists of one nonstick surface of malleable metal alloy combined with high-performance phase-change material. It can be applied at room temperature. When heated to 158oF (70oC) and under pressures as low as 5 psi, T-mate flows to fill any surface irregularities. Its smooth metal alloy surface allows the heat sink to separate from the device.
October 2001, Circle 229
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