Selecting a reflow oven for use in a surface-mount technology (SMT) manufacturing process requires numerous engineering considerations, including board size capacity, heating zones, nitrogen compatibility and the ability to maintain even heat.
With the introduction of lead-free materials, new and more complicated factors are compounding the decision. Process engineers must also consider the ability to achieve the heat required to reflow the lead-free solder paste and to cool the soldered joints at a rate that will provide the best possible product quality. To help, SMT manufacturing experts from Speedline Technologies, Franklin, Mass., will address the issues involved in a free, live Web seminar on May 19.
The one hour seminar, which begins at 11 a.m. Eastern time, will include:
- An analysis of energy and nitrogen consumption in lead-free reflow soldering equipment.
- A comparison of energy consumption in new reflow oven designs vs. previous reflow oven designs.
- An actual power consumption case study of lead-free vs. tin lead process.
- Methods for controlling nitrogen consumption.
For more information and to register, or to view Speedline's complete lineup of Web-based seminars, visit www.speedlinetech.com/seminars.