The Franklin, Mass.-based firm's papers focus on three critical areas in the process: reflow soldering, lead-free assembly and solder-paste printing. The titles are:
- “Fluxing Effects in Lead-Free Wave Soldering,” by Ken Kirby, applications engineer; and Keith Howell, product marketing manager.
- “Affects of Cooling Slopes in Lead-Free Reflow,” by Marc Apell, product marketing manager; Tad Formella, applications engineer; and Rich Burke, sales engineer.
- “Practical Lead-Free Assembly,” by Joe Belmonte, senior process engineer of the Advanced Process Group.
- “Bridge Vision: An Analysis of Bridge Defects in the Solder Paste Printing Process,” by David Prince, senior engineer in advanced development.