PC02-14 Polyimide Cure Solution is designed for polyimide baking and curing applications. The cleaning process oven optimizes the polyimide cure process for semiconductor wafer devices. It enables short cycle times and a consistent, reproducible cure process for all wafers in the product load by combining four essential characteristics into a single design: Class 10 clean process operation, inert atmosphere capabilities (less than 20 ppm of oxygen), temperatures up to 662 degrees F (350 degrees C) and fast cycle times with +/-1 percent part uniformity.
Polyimide Curing Batch Oven
October 1, 2005