PCO2-14 optimizes the polyimide cure process for semiconductor wafer devices. It enables short cycle times and a consistent, reproducible cure process for all wafers in the product load by combining four characteristics in a single, compact design: clean process operation (Class 10), inert atmosphere capabilities (<20 ppm of oxygen), temperatures up to 662°F (350°C), and fast cycle times with ±1% part uniformity. It can be networked and controlled from a central location, minimizing the floor space required, and atmosphere data can be monitored and recorded throughout the cycle.
Semiconductor Polyimide Curing Batch Oven
January 30, 2006