Resbond 940 is intended for high-temperature (3,000oF [1,649oC]) bonding, sealing and encapsulating applications. Low-to-high thermal expansion, ultra-high temperature, machinable, super-fast setting, metallic-based and electrically or thermally conductive grades are available. The ceramic material adheres to quartz, cordierite, fused silica, glassware, ceramics and metals. It cures in 4 to 8 hr at room temperature or in 5 min at 175oF (79oC) and offers chemical and thermal shock resistance.

Cotronics Corp.
(718) 646-7996