Companies interested in temperature profiling reflow ovens can request a Mega M.O.L.E. 2.0 and M.A.P. guides from Electronic Control Design (ECD) Inc., Milwaukie, Ore. M.A.P. is a company-specific acronym for “Machine, Assembly, Process” that takes a systematic approach to the:
- Machine, a reflow oven.
- Assembly, a printed circuit board.
- Process, the thermal profile specified by the solder paste manufacturer for proper reflow.
To request copies of the guides, visit www.ecd.com or call (503) 659-6100.