A series of webinars from IPC – Association Connecting Electronics Industries, Bannockburn, Ill., offer companies an opportunity to bring IPC technical information to a large number of employees at one time.

A series of webinars from IPC – Association Connecting Electronics Industries, Bannockburn, Ill., offer companies opportunities to bring IPC technical information to a large number of employees at one time. The one-hour sessions will cover:
  • "New Developments in ENIG and ENEPIG for Today’s Electronic Products," presented by George Milad, Uyemura International Corp., January 19.

  • "Everything You Always Wanted to Know About TH Soldering but Were Afraid to Ask," presented by Bob Klenke, ITM Consulting, January 26.

  • "Why Wedge Bond," presented by Lee Levine, Hesse & Knipps, January 31.

  • "Key Issues in BTC Design & Assembly for Improved Reliability and Yield," presented by Ray Prasad, Ray Prasad Consultancy Group, February 1.

  • "Rework of Bottom Terminated Components (QFNs, LGAs, etc.)," presented Norman Mier, Best Inc., February 2.

  • "Troubleshooting SMT Yield Problems," presented by Ray Prasad, Ray Prasad Consultancy Group, February 7.

  • "Life After the Super Committee Deadline – What Now," presented by Keith Smith and Rich Meade, Prime Policy Group, February 8.

  • "Flex Repair," presented by James Bernhardt, BESTProto Inc., March 13.

  • "Discussion and Highlights of IPC-4204A, Flexible Base Dielectrics for Use in Flexible Printed Circuitry," presented by Clark Webster, All Flex LLC, and Michael Beauchesne, Amphenol Printed Circuits, March 15
The registration fee of $75 per login for IPC members or $100 per login for nonmembers covers as many employees as can fit in a company’s conference or training room. Webinars will run from 10 to 11 a.m. CT. For more information and to register, visit www.ipc.org/webinar-schedule.

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