A series of webinars from IPC – Association Connecting Electronics Industries, Bannockburn, Ill., offer companies opportunities to bring IPC technical information to a large number of employees at one time. The one-hour sessions will cover:
Developments in ENIG and ENEPIG for Today’s Electronic Products," presented
by George Milad, Uyemura International Corp., January 19.
- "Everything You
Always Wanted to Know About TH Soldering but Were Afraid to Ask," presented
by Bob Klenke, ITM Consulting, January 26.
- "Why Wedge Bond,"
presented by Lee Levine, Hesse & Knipps, January 31.
- "Key Issues in BTC
Design & Assembly for Improved Reliability and Yield," presented by Ray
Prasad, Ray Prasad Consultancy Group, February 1.
- "Rework of Bottom
Terminated Components (QFNs, LGAs, etc.)," presented Norman Mier, Best
Inc., February 2.
SMT Yield Problems," presented by Ray Prasad, Ray Prasad Consultancy Group,
- "Life After the
Super Committee Deadline – What Now," presented by Keith Smith and Rich
Meade, Prime Policy Group, February 8.
- "Flex Repair,"
presented by James Bernhardt, BESTProto Inc., March 13.
- "Discussion and Highlights of IPC-4204A, Flexible Base Dielectrics for Use in Flexible Printed Circuitry," presented by Clark Webster, All Flex LLC, and Michael Beauchesne, Amphenol Printed Circuits, March 15