A single-component epoxy adhesive that contains a blend of special thermally conductive fillers, Supreme 18TC can be applied in bond lines as thin as 10 to 15 µm. It offers a thermal resistance of 5 to 7 x 10-6 K•m2/W and a thermal conductivity of 22 to 25 BTU•in/ft2•hr•°F [3.17 to 3.61 W/(m·K)]. The adhesive maintains high bond strength properties even when exposed to hostile environmental conditions, including high/low temperatures. It bonds well to a variety of substrates, including metals, composites, ceramics and plastics.
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