The SMT Hybrid Packaging international exhibition and conference held its first ever Rework Experience Competition to test participants’ skills in reworking a finished printed circuit board.
The challenge? Assemble area-array devices and fine-pitch packages, and then remove the packages from the board. The board had to be reworked to make it functional again.
All seven competitors successfully completed the challenge, but Ljupce Talevski from Aluwave AB took first place. Second place went to Ekatarina Stahlmann from Grundig Business Systems and Conny Hielscher from Grundig Business Systems finished in third.