SMT Hybrid Packaging 2017 will host IPC’s Hand Soldering Competition May 16-18 in Nuremberg, Germany. Skilled competitors will use their soldering irons to compete for cash prizes and a spot at the IPC Hand Soldering World Championship in Munich in November.
Hand soldering of high density printed boards calls for a zero-defect soldering process, and this annual competition recognizes the best skills in hand soldering complex printed board assemblies. Participants will compete against each other over three days to build a functional electronics assembly within a 60-min time limit.
The assemblies will be judged on three factors: the quality of the soldering in accordance with IPC-A-610F Class 3 criteria; the speed at which the assembly was produced; and overall electrical functionality of the assembly.