Use High-Temperature Potting Compound for Potting, Encapsulation
Aremco-Bond 2315 can be used in electronic applications to 365°F (185°C). The high-temperature, thermally conductive compound is suited for potting and encapsulating densely packaged power supplies, rectifiers, integrated circuits, thick-film hybrid devices, digital-analog converters, oscillators, amplifiers, relays, transformers and semiconductors. Recommended cure is 2 hours at 160°F (70°C) plus 2 hours at 300°F (149°C). Features include high thermal conductivity, good electrical insulation and low shrinkage after cure.
Aremco Products Inc.