Automated stand-alone hot-bar system combines flux dispensing with hot-bar reflow soldering for applications where process automation, production output and product quality inspection are required. A motorized, five-position indexer offers high speed product handling and position repeatability. Another system, the C-slide, is suited for all kinds of applications using anisotropic conductive film (ACF) final or heat-seal bonding, hot-bar reflow soldering and heat-staking processes to produce LCD, flex foil and PCB interconnections. ACF bonding is a hot-bar technique to make electrical connections between flexible-to-rigid circuit boards, flex-to-glass-panel displays and flex to flex. All systems use pneumatic bonding-head technology and offer closed-loop process-data storage.

Nordson DIMA

760-431-1919

www.nordson.com