Batch Oven to Assist in Curing of Adhesives
A semiconductor manufacturing company will use a Blue M batch oven to cure of adhesive material on circuit boards and help the company meet tight processing specifications.
The oven, shipped by Thermal Product Solutions, has a designated temperature range of 59°F (32.7°C) above ambient to 600°F (316°C). It is designed to provide a high degree of temperature control via the high volume horizontal air-recirculation system. In addition, the electric heating system and the horizontal airflow (rom right to left are designed to maximize temperature uniformity and heating rates within the oven chamber.
The oven’s tip-resistant shelves ease unloading while minimizing the risk of tipping. High power is used for fast heatup to desired temperatures.