Recent advances in thermoelectric and thermionic materials, thermotunneling, magnetic refrigeration and vapor compression may offer solutions to unmet demand for efficiency, miniaturization, performance and environmental friendliness. To educate industry about these changes, RTI International, Research Triangle Park, N.C., is hosting the first in its new Technology Venture Forum series, bringing together innovators, market-trends analysts and venture capitalists.
RTI's forum on "Next-Generation Thermal Management Materials and Systems" is slated for October 28-30 in Dallas/Fort Worth, Texas. The conference will cover market trends and needs for thermal management in electronic devices and systems, automotives, refrigeration and other large-scale cooling, and power conversion.
Visit http://techventure.rti.org or contact Susan E. Brown at (919) 541-7401, e-mail email@example.com.