Formulated for electrical potting and encapsulation applications, Model EP36AO combines high thermal conductivity with thermal stability. The flexible, heat-resistant epoxy is serviceable over the temperature range of -80 to 500°F (-62 to 260°C). Once cured, it has a dielectric strength of 400 V/mil; a volume resistivity of 2 to 3 x 1012 ohm-cm and thermal conductivity of 9 to 10 BTU-in/ft2-hr-°F at 77°F (25°C). It adheres to metallic and non-metallic substrates.
Master Bond Inc.